In order to facilitate the partner application process for the SH-Mobile Consortium, we are offering a web-based application method.
After reading the disclaimer and agreeing to the terms, please prepare two copies of the NDA (non-disclosure agreement), and one copy of the application form. Please fill out all of the necessary information and after signing/stamping, please mail these back to us.
Please be aware that it may take some time to process your application; we ask for your kind understanding in the meantime.
Mailing address:
Renesas Technology Corp.
SH-Mobile Consortium Head Office
Mobile Product Marketing Dept.
Nippon Bldg. 2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004 Japan
Inquiries:
mobile-consortium@renesas.com |
