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Visitors who have successfully completed the application process can enter the member area by entering their ID and Password.
 
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How to join

 

In order to facilitate the partner application process for the SH-Mobile Consortium, we are offering a web-based application method.

After reading the disclaimer and agreeing to the terms, please prepare two copies of the NDA (non-disclosure agreement), and one copy of the application form. Please fill out all of the necessary information and after signing/stamping, please mail these back to us.

Please be aware that it may take some time to process your application; we ask for your kind understanding in the meantime.

Mailing address:
Renesas Technology Corp.
SH-Mobile Consortium Head Office
Mobile Product Marketing Dept.
Nippon Bldg. 2-6-2, Ote-machi, Chiyoda-ku, Tokyo 100-0004 Japan

Inquiries:
mobile-consortium@renesas.com

 
 



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